Anhydride curing agents feature an acid anhydride structure and offer low viscosity and high electrical insulation.
They provide excellent heat resistance after high-temperature curing with low shrinkage, and are commonly used in high-performance epoxy coatings, insulating resins, and PCB coatings.

Amine-based curing agents react with epoxy groups to enable rapid curing even at room temperature.
With high reactivity and strong adhesion, they are widely used in electronic materials, flooring systems, and adhesives.